Lisheng Wang
General Partner at TSVC
· San Francisco Bay Area
Check size
$250K-$3M
Lead stage
Pre-Seed
Deals tracked
0
Sectors
Deep Technology, Semiconductors and Advanced Materials
Deep Technology
Semiconductors and Advanced Materials
Robotics and Automation
Artificial Intelligence and Machine Learning
Physical AI and Autonomous Systems
Advanced Manufacturing
Pre-Seed
Seed
Series A
Silicon Valley
United States
About Lisheng
Lisheng Wang is an investor at TSV Capital focused on physical AI and deep technology. Based in the San Francisco Bay Area, Wang holds a degree from MIT and is actively engaged in the hard tech and manufacturing innovation sectors. His investment thesis centers on applying AI to real-world economic problems through robotics and applied AI solutions
Investment thesis
Identifying and nurturing exceptional founders building transformative technologies in deeptech, healthtech, and the data economy.
TSVC is a seed-stage venture capital firm founded in 2010 that identifies forward-thinking entrepreneurs
Investment philosophy
TSVC believes that the most defensible companies are built on hard technology and solve real problems at scale. The firm leverages its Tsinghua network and operational expertise to support founders from seed through their critical early milestones.
Investment focus
Physical AI and deep tech applications that drive real-world economic impact, with particular emphasis on manufacturing automation and robotics. Wang targets founders building hardware-software integrated solutions at the intersection of AI and industrial production
Areas of expertise
Frequently asked
Does Lisheng Wang invest at Pre-Seed stage?
Yes. They invest at Pre-Seed, Seed, Series A stage.
Their geographic focus includes Silicon Valley, United States.
What is their typical check size?
Lisheng Wang's typical check size is $250K-$3M.
They currently invest through TSVC.
What sectors does Lisheng Wang focus on?
Lisheng Wang primarily invests in Deep Technology, Semiconductors and Advanced Materials, Robotics and Automation, Artificial Intelligence and Machine Learning.
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